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发布于:2019-3-27 16:46:30  访问:137 次 回复:0 篇
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Soldering Iron Tips
To fully realize the situation, we need to determine what makes up a typical rosin based solder fume. A typical solder fume is a mixture of tiny particles (smoke) and gases which may be explained as around 95percent particulates (the real smoke plume), and around 5% gases and vapours which could include a cocktail of Acetones, Methyl Alcohol, Formaldehyde, Carbon Dioxide, Diterpine Acid, Carbon Monoxide and Isopropyl Alcohol. Note: Even `Synthetic` and `No Clean` fluxes can lead to serious lung irritation
As soon as inhaled, the lung area cannot easily remove particle sizes under 10 microns. If you knew a human being locks is around 100 microns in diameter, think about this - the biggest solder fume particle is just about 10 microns in diameter therefore the littlest is about 0.3 microns (you can only just see 30 microns by having a naked attention).
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9. Finishing - the entire process of coating the pad areas having a slim layer of solder to prepare the board for the wave that is eventual or reflow soldering process that will occur later on following the components were placed.
10. Silk Screening - the process of using the markings for component designations and component outlines to your board. May be placed on simply the top part or to both edges if elements are installed on both top and bottom edges.
11. Routing - the process of isolating boards that are multiple a panel of identical boards; this method additionally allows cutting notches or slots in to the board if required.
12. Quality Control - a artistic examination regarding the boards; may also function as the procedure of inspecting wall surface quality for plated through holes in multilayer boards by cross-sectioning or other practices.
13. electric Testing - the entire process of checking for continuity or shorted connections regarding the boards by means applying a voltage between different points regarding the board and determining in cases where a current flow occurs. Dependant on the board complexity, this method may require a specially designed test fixture and test program to integrate using the test that is electrical used by the board manufacturer.
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